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Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects

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journal contribution
posted on 22.10.2008 by Jianfeng Li, Samjid H. Mannan, Mike P. Clode, Keming Chen, David C. Whalley, David A. Hutt, Paul Conway
This paper reports on the interfacial reactions and lifetime of electroless Ni-P coatings in contact with molten Sn-Bi based solders. A layer of approximately 4 m thick electroless Ni-P in contact with the molten Sn-58Bi solder began to fail at 48 h at temperatures between 200 C and 240 C. Elemental additions to modify the solder, included 1–2wt.% of Al, Cr, Si, Zn, Ag, Au, Ru, Ti, Pt, Nb, and Cu. Of these, only Cu modified the interfacial intermetallic compound growth from Ni3Sn4 to (Cu,Ni)6Sn5, resulting in significantly decreased consumption rates of the Ni-P substrate in contact with the molten solder and increasing the lifetime of the Ni-P layer to between 430 and 716 h. Micro cracks were observed in all but the thinnest Ni-P layers, allowing the solder to penetrate.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

LI, J. ...et al, 2008. Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnects. transactions on components and packaging technologies, 31 (3), pp. 574 – 585

Publisher

© Institute of Electrical and Electronics Engineers (IEEE)

Publication date

2008

Notes

This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technologies [© IEEE], and is available from: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISSN

1521-3331

Language

en

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