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Lamination based embossing technique for LTCC

journal contribution
posted on 09.07.2020 by Stefan P Wilhelm, Robert W Kay, Mazher Mohammed, Yves Lacrotte, Marc PY Desmulliez
This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.

Funding

Engineering and Physical Sciences Research Council (EPSRC) from the Innovative electronics Manufacturing Research Council (IeMRC) under the flagship project ‘‘Smart Microsystems’’.

History

School

  • Design

Published in

Microsystem Technologies

Volume

19

Issue

6

Pages

801 - 807

Publisher

Springer Science and Business Media LLC

Version

VoR (Version of Record)

Rights holder

© Springer-Verlag Berlin Heidelberg

Acceptance date

15/11/2012

Publication date

2012-12-04

Copyright date

2012

ISSN

0946-7076

eISSN

1432-1858

Language

en

Depositor

Dr Mazher Mohammed. Deposit date: 8 July 2020

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