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Thin film thickness measurements using Scanning White Light Interferometry

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journal contribution
posted on 17.12.2014, 14:19 by Bianca Maniscalco, Piotr Kaminski, Michael Walls
Scanning White Light Interferometry is a well-established technique for providing accurate surface roughness measurements and three dimensional topographical images. Here we report on the use of a variant of Scanning White Light Interferometry called coherence correlation interferometry which is now capable of providing accurate thickness measurements from transparent and semi-transparent thin films with thickness below 1 μm. This capability will have many important applications which include measurements on optical coatings, displays, semiconductor devices, transparent conducting oxides and thin film photovoltaics. In this paper we report measurements of thin film thickness made using coherence correlation interferometry on a variety of materials including metal-oxides (Nb2O5 and ZrO2), a metal-nitride (SiNx:H), a carbon-nitride (SiCxNy:H) and indium tin oxide, a transparent conducting oxide. The measurements are compared with those obtained using spectroscopic ellipsometry and in all cases excellent correlation is obtained between the techniques. A key advantage of this capability is the combination of thin film thickness and surface roughness and other three-dimensional metrology measurements from the same sample area.

Funding

The authors are grateful to EPSRC and TSB for funding. We are also grateful to Mr Daniel Mansfield and his colleagues at Taylor Hobson Ltd for the collaboration in this study and for funding a studentship for Biancamaria Maniscalco.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Research Unit

  • Centre for Renewable Energy Systems Technology (CREST)

Published in

THIN SOLID FILMS

Volume

550

Pages

10 - 16 (7)

Citation

MANISCALCO, B., KAMINSKI, P.M. and WALLS, J.M., 2014. Thin film thickness measurements using Scanning White Light Interferometry. Thin Solid Films, 550, pp. 10 - 16.

Publisher

Elsevier © the authors

Version

VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution 3.0 Unported (CC BY 3.0) licence. Full details of this licence are available at: http://creativecommons.org/licenses/by/3.0/

Publication date

2014

Notes

This is an Open Access Article. It is published by Elsevier under the Creative Commons Attribution 3.0 Unported Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/3.0/

ISSN

0040-6090

Language

en

Licence

Exports