posted on 2019-09-30, 10:59authored byAndrea Vallecchi, Darren Cadman, William WhittowWilliam Whittow, John Vardaxoglou, Ekaterina Shamonina, Christopher J Stevens, J. C. Vardaxoglou
The additive manufacturing process of multimaterial extrusion offers performance advantages using functional
materials including conductors while making accessible the third
dimension in the design of electronics. In this work we show that
the additional geometrical freedom offered by this technique can
be exploited for the design and realisation of filters made of
three- dimensional (3D) resonators that exhibit enhanced characteristics. The coupling properties of 3D grounded square split
ring resonators (SRRs) are initially explored. We demonstrate
by simulations and experiments that SRRs with finite height
display significantly stronger coupling compared to equivalent
thin printed circuit structures. The observed trend can be
exploited for designing filters with wider operational bandwidths
for a given footprint, or miniaturized layouts and enhanced
compatibility with fabrication limits for minimum feature size
and spacing without performance degradation. This concept is
demonstrated by presenting results of full-wave simulations for
sample bandpass filters with identical footprint but formed by
coupled 3D square SRRs of different heights, showing that filters
with taller resonators exhibit increasingly wider bandwidths.
Two filter prototypes with centre frequencies at 1.6 GHz and
2.45 GHz are manufactured by multimaterial 3D printing. The
measured characteristics of these prototypes are found to be in
good agreement with numerical simulations taking into account
the effect of the lossier metallic and dielectric materials used in
3D printing and confirm the predicted larger bandwidth of the
filters made of 3D SRRs with marginally higher insertion losses.
Funding
Synthesizing 3D Metamaterials for RF, Microwave and THz Applications (Grant ref: EP/N010493/1)
History
School
Mechanical, Electrical and Manufacturing Engineering
Published in
IEEE Transactions on Microwave Theory and Techniques
Volume
67
Issue
11
Pages
4341 - 4352
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Version
VoR (Version of Record)
Publisher statement
This is an Open Access Article. It is published by IEEE under the Creative Commons Attribution 4.0 Unported Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/