posted on 2011-09-20, 09:17authored byVincent Dwyer
An accurate estimation of the Blech length, the critical line length below which interconnect lines are
immortal, is vital as it allows EDA tools to reduce their workload. In lines longer than the Blech length,
either a void will inevitably nucleate and grow until the line fails, or the line will rupture. The majority
of failure analyses reveal voiding as the failure mechanism however recent analysis suggest Blech length
failures are characterised by simultaneous [6] voiding and rupture, and a non-zero steady-state drift
velocity. This paper provides an alternative interpretation of results.
History
School
Mechanical, Electrical and Manufacturing Engineering
Citation
DWYER, V.M., 2011. Analysis of critical-length data from electromigration failure studies. Microelectronics Reliability. Proceedings of the 22th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 51 (9-11), pp. 1568-1572.