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Analysis of critical-length data from electromigration failure studies

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journal contribution
posted on 20.09.2011, 09:17 authored by Vincent Dwyer
An accurate estimation of the Blech length, the critical line length below which interconnect lines are immortal, is vital as it allows EDA tools to reduce their workload. In lines longer than the Blech length, either a void will inevitably nucleate and grow until the line fails, or the line will rupture. The majority of failure analyses reveal voiding as the failure mechanism however recent analysis suggest Blech length failures are characterised by simultaneous [6] voiding and rupture, and a non-zero steady-state drift velocity. This paper provides an alternative interpretation of results.

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  • Mechanical, Electrical and Manufacturing Engineering

Citation

DWYER, V.M., 2011. Analysis of critical-length data from electromigration failure studies. Microelectronics Reliability. Proceedings of the 22th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 51 (9-11), pp. 1568-1572.

Publisher

© Elsevier Ltd.

Version

AM (Accepted Manuscript)

Publication date

2011

Notes

This article was published in the journal, Microelectronics Reliability, Proceedings of the 22th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis [© Elsevier Ltd.] and the definitive version is available at: http://dx.doi.org/10.1016/j.microrel.2011.06.036

Language

en

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