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Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory
journal contributionposted on 2008-10-22, 10:20 authored by Samjid H. Mannan, David Whalley, Adebayo Oluyinka Ogunjimi, David Williams
This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 m pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array ( BGA) chip scale packaging (CSP) and also flip-chip and conventional ball grid array (BGA) package structures. The paper presents the results of computational fluid dynamics (CFD) models of the early stages of the assembly process when the adhesive is squeezed out between the device and the substrate. Experimental results on the assembly trials are presented in an accompanying paper  and have been previously reported at the Adhesives in Electronics Conference, Gothenburg, 1996 . The CFD models outlined here show how those results might be expected to change for smaller pitches.
- Mechanical, Electrical and Manufacturing Engineering
CitationMANNAN, S. H. ...et al, 1996. Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theory. IEEE transactions on components, packaging and manufacturing technology - Part C, 19 (4), pp. 264-269
Publisher© Institute of Electrical and Electronics Engineers (IEEE)
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