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Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment

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journal contribution
posted on 22.10.2008, 10:04 authored by Adebayo Oluyinka Ogunjimi, Samjid H. Mannan, David Whalley, David Williams
This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 m pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array ( BGA), chip scale packaging (CSP), and also flip-chip and conventional ball grid array (BGA) package structures. A range of materials combinations have been evaluated, including (random filled) adhesive materials based on both thermoplastic and thermosetting resin systems, combined with both organic and thick-film on ceramic substrate materials. The ACA’s used have all been applied as films, and hence are also known as anisotropic conducting films (ACF). The test assemblies have been constructed using a specially developed instrumented assembly system which allows the measurement of the process temperatures and pressures and the consequent bondline thickness reduction and conductivity development. The effects of the process parameters on the resulting properties, particularly conductivity and yield, are reported. A complementary paper [1] indicates the results of computational fluid dynamics (CFD) models of the early stages of the assembly process which allow the extrapolation of the present results to finer pitch geometries.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

OGUNJIMI, A. O. ...et al, 1996. Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experiment. IEEE transactions on components, packaging and manufacturing technology - Part C, 19 (4), pp. 257-263

Publisher

© Institute of Electrical and Electronics Engineers (IEEE)

Publication date

1996

Notes

This is a journal article. It was published in the journal IEEE transactions on components, packaging and manufacturing technology - Part C [© IEEE], and is available from: http://ieeexplore.ieee.org/servlet/opac?punumber=3476 . Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISSN

1083-4400

Language

en