Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition
journal contributionposted on 08.05.2015, 15:17 by Yuanming Chen, Jianhui Lin, Tianyang Qiu, Wei He, Vadim Silberschmidt, Shouxu Wang, Ze Tan
Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H2SO4 solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide.
The authors gratefully acknowledge the support of Guangdong Innovative Research Team Program (No. 201301C0105324342), National Natural Science Foundation of China (No. 61474019) and Ph.D. Programs Foundation of Ministry of Education of China (No. 20120185110021), and we also express our sincere thanks to the support of China Scholarship Council (No. 201306070032).
- Mechanical, Electrical and Manufacturing Engineering