Data-driven turbulence anisotropy in film and effusion cooling flows
Film and effusion cooling flows contain complex flow that classical Reynolds-Averaged Navier Stokes (RANS) models struggle to capture. ATensor-BasisNeuralNetwork (TBNN) is employed to provide an anisotropic model that can reproduce the Reynolds stress fields of Large-Eddy Simulations (LES). High-quality LES datasets are used to train, validate and test a neural network model. A priori results show the model can reproduce the Reynolds stress field on a cooling case not present in the modelโs training. The neural networks is employed directly into RANS solver, augmenting a ๐-๐ Shear Stress Transport (SST) model, with conditioning applied. The model provided improvements to Reynolds stress, velocity and temperature fields in cases not used to train the model, including a multi-hole case that differs from the single-hole geometry used to train the case. Under predictions of the turbulent kinetic energy field, modelled with the SST transport equation, was found to lead to underpredictions in the neural network produced Reynolds stresses. Correcting this with the LES resolved turbulent kinetic energy provided further agreement. The method found significant improvements to the surface cooling results that advances the current state-of-the-art in RANS modelling of film and effusion cooling flows.
Funding
EPSRC Centre for Doctoral Training in Gas Turbine Aerodynamics
Engineering and Physical Sciences Research Council
Find out more...History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Aeronautical and Automotive Engineering
Published in
Physics of FluidsVolume
35Issue
10Publisher
AIP PublishingVersion
- VoR (Version of Record)
Rights holder
ยฉ Author(s)Publisher statement
This is an Open Access article published by AIP Advances. All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).Acceptance date
2023-09-08Publication date
2023-10-05Copyright date
2023ISSN
1070-6631eISSN
1089-7666Publisher version
Language
- en