Deciphering the adaption of bacterial cell wall mechanical integrity and turgor to different chemical or mechanical environments
Bacteria adapt the mechanical properties of their cell envelope, including cell wall stiffness, turgor, and cell wall tension and deformation, to grow and survive in harsh environments. However, it remains a technical challenge to simultaneously determine these mechanical properties at a single cell level. Here we combined theoretical modelling with an experimental approach to quantify the mechanical properties and turgor of Staphylococcus epidermidis. It was found that high osmolarity leads to a decrease in both cell wall stiffness and turgor. We also demonstrated that the turgor change is associated with a change in the viscosity of the bacterial cell. We predicted that the cell wall tension is much higher in deionized (DI) water and it decreases with an increase in osmolality. We also found that an external force increases the cell wall deformation to reinforce its adherence to a surface and this effect can be more significant in lower osmolarity. Overall, our work highlights how bacterial mechanics supports survival in harsh environments and uncovers the adaption of bacterial cell wall mechanical integrity and turgor to osmotic and mechanical challenges.
Funding
Multiscale characterization of complex materials using a combination of atomic force microscopy and optical coherence tomography
Engineering and Physical Sciences Research Council
Find out more...Biofilm Resistant Liquid-like Solid Surfaces in Flow Situations
Engineering and Physical Sciences Research Council
Find out more...History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Materials
Published in
Journal of Colloid and Interface ScienceVolume
640Pages
510 - 520Publisher
ElsevierVersion
- VoR (Version of Record)
Rights holder
© The Author(s)Publisher statement
This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).Acceptance date
2023-02-19Publication date
2023-02-23Copyright date
2023ISSN
0021-9797eISSN
1095-7103Publisher version
Language
- en