Binder1.pdf (435.98 kB)
Determination of residual stress and interface adhesion toughness of thin films by blisters
journal contribution
posted on 2019-04-01, 10:14 authored by Bo Yuan, Christopher HarveyChristopher Harvey, Gary W. Critchlow, Rachel ThomsonRachel Thomson, Simon WangSimon WangCircular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films
under constant bi-axial compressive residual stress. In this work, new mechanical models are
used in conjunction with measurements of blister morphology parameters to determine the
residual stress in films and the adhesion toughness at interfaces. These new models are based
on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and
growth of blisters instead of buckling, as in the conventional models, since the thin films are
under constant compressive residual stress. Predictions from the models are in excellent
agreement with independent experimental data.
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Aeronautical and Automotive Engineering
Published in
Material Design and Processing CommunicationVolume
1Issue
5Citation
YUAN, B. ... et al., 2019. Determination of residual stress and interface adhesion toughness of thin films by blisters. Material Design and Processing Communication, 1 (5), e60.Publisher
© WileyVersion
- AM (Accepted Manuscript)
Publisher statement
This is the peer reviewed version of the following article: YUAN, B. ... et al., 2019. Determination of residual stress and interface adhesion toughness of thin films by blisters. Material Design and Processing Communication, 1 (5), e60, which has been published in final form at https://doi.org/10.1002/mdp2.60. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions.Acceptance date
2019-03-20Publication date
2019-04-02ISSN
2577-6576Publisher version
Language
- en