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Download fileDetermination of residual stress and interface adhesion toughness of thin films by blisters
journal contribution
posted on 01.04.2019, 10:14 authored by Bo Yuan, Christopher HarveyChristopher Harvey, Gary W. Critchlow, Rachel ThomsonRachel Thomson, Simon WangSimon WangCircular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films
under constant bi-axial compressive residual stress. In this work, new mechanical models are
used in conjunction with measurements of blister morphology parameters to determine the
residual stress in films and the adhesion toughness at interfaces. These new models are based
on the hypothesis that pockets of energy concentration (PECs) drive the nucleation and
growth of blisters instead of buckling, as in the conventional models, since the thin films are
under constant compressive residual stress. Predictions from the models are in excellent
agreement with independent experimental data.
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- Aeronautical, Automotive, Chemical and Materials Engineering
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- Aeronautical and Automotive Engineering