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Evaporation of pinned sessile microdroplets of water on a highly heat-conductive substrate: Computer simulations

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posted on 2017-07-17, 09:08 authored by Sergey Semenov, Victor Starov, Ramon Rubio
The aim of the current numerical study is to investigate the influence of individual effects (kinetic effects, latent heat of vaporization, Marangoni convection, Stefan flow, droplet’s surface curvature) on the rate of evaporation of a water droplet placed on a highly heat conductive substrate for different sizes of the droplet (down to submicron sizes). We performed simulations for one particular set of parameters: the ambient relative air humidity is set to 70%, the ambient temperature is 20 ∘C, the contact angle is 90∘, and the substrate material is copper. The Suggested model combines both diffusive and kinetic models of evaporation. The obtained results allow estimation of the characteristic droplet sizes where each of the mentioned above phenomena becomes important or can be neglected.

Funding

This work has been done under the umbrella of COST Action MP1106. Research was supported by the European Union under Grant MULTIFLOW FP7-ITN-2008-214919, and EPSRC UK grant EP/D077869/1.

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering

Department

  • Chemical Engineering

Published in

European Physical Journal: Special Topics

Volume

219

Issue

1

Pages

143 - 154

Citation

SEMENOV, S., STAROV, V. and RUBIO, R., 2013. Evaporation of pinned sessile microdroplets of water on a highly heat-conductive substrate: Computer simulations. European Physical Journal: Special Topics, 219(1), pp. 143-154.

Publisher

© EDP Sciences. Published by Springer

Version

  • AM (Accepted Manuscript)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2013

Notes

The final publication is available at Springer via http://dx.doi.org/10.1140/epjst/e2013-01789-y

ISSN

1951-6355

eISSN

1951-6401

Language

  • en

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