posted on 2018-01-11, 09:38authored byJianglong Guo, Thomas Bamber, Jagpal Singh, D. Manby, Paul A. Bingham, Laura JusthamLaura Justham, Jon PetzingJon Petzing, Jacques Penders, Michael R. Jackson
Electroadhesion is a promising adhesion mechanism for robotics and material handling applications due to several distinctive advantages it has over existing technologies. These advantages include enhanced adaptability, gentle/flexible handling, reduced complexity, and ultra-low energy consumption. Unstable electroadhesive forces, however, can arise in ambient environments. Electroadhesive devices that can produce stable forces in changing environments are thus desirable. In this study, a flexible and environmentally stable electroadhesive device was designed and manufactured by conformally coating a layer of barium titanate dielectric on a chemically etched thin copper laminate. The results, obtained from an advanced electroadhesive "normal force" testing platform, show that only a relative difference of 5.94% in the normal force direction was observed. This was achieved when the relative humidity changed from 25% to 53%, temperature from 13.7 °C to 32.8 °C, and atmospheric pressure from 999 hPa to 1016.9 hPa. This environmentally stable electroadhesive device may promote the application of the electroadhesion technology.
Funding
The authors acknowledge support from the EPSRC Centre for Innovative Manufacturing in Intelligent Automation, under Grant Reference No. EP/IO33467/1, and support from Innovate UK under Project Reference No. 101549.
History
School
Mechanical, Electrical and Manufacturing Engineering
Published in
Applied Physics Letters
Volume
111
Issue
25
Citation
GUO, J. ... et al, 2017. Experimental study of a flexible and environmentally stable electroadhesive device. Applied Physics Letters, 111 (25), 251603.
This work is made available according to the conditions of the Creative Commons Attribution 4.0 International (CC BY 4.0) licence. Full details of this licence are available at: http://creativecommons.org/licenses/ by/4.0/
Publication date
2017
Notes
This is an Open Access Article. It is published by AIP Publishing under the Creative Commons Attribution 4.0 International Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/