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Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics

journal contribution
posted on 01.03.2021, 11:59 by Chengjiong Tuo, Zhenhua Yao, Wei Liu, Shengfa Liu, Li Liu, Zhiwen Chen, Shangyu Huang, Changqing LiuChangqing Liu, Xueqiang Cao
Cu@Ag core-shell particles not only have advantages of Cu and Ag elements but also inhibit Ag migration and Cu oxidation issues. These particles can be potential die attach materials for power electronics. However, micro/nano particles sintering normally form residuals and voids due to binder. Electromagnetic compaction (EMC) can fabricate Cu@Ag solder preforms with low porosity and high internal stress, which can be a trigger to successfully decrease the bonding temperature and pressure during die attach process in previous work. In this work, Cu@Ag solder preform was fabricated by electroless plating and EMC. Effects of EMC parameters on microstructure, property and formation mechanism of Cu@Ag powders were systematically investigated. As the input voltage increased from 2800V to 4400V, the compaction pressure rose to nearly 2700N. The compactness and density of Cu@Ag solder preform increased linearly, while their roughness and resistivity dropped significantly. Besides, thermal stability, oxidation resistance and 2 corrosion resistance of Cu@Ag solder preforms also increased with higher compactness.

Funding

Natural Science Foundation of Hubei Province (Grant No. 2018CFB212)

National Nature Science Foundation of China (Grant No. 62004144, 61904127, 61804135)

Fundamental Research Funds for the Central Universities (Grant No. 202401002, 203134004, 2042019kf0013).

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

Journal of Materials Processing Technology

Volume

292

Publisher

Elsevier BV

Version

AM (Accepted Manuscript)

Rights holder

© Elsevier

Publisher statement

This paper was accepted for publication in the journal Journal of Materials Processing Technology and the definitive published version is available at https://doi.org/10.1016/j.jmatprotec.2021.117056

Acceptance date

11/01/2021

Publication date

2021-01-19

Copyright date

2021

ISSN

0924-0136

Language

en

Depositor

Prof Changqing Liu. Deposit date: 27 February 2021

Article number

117056