NTC Thermistor JRM Electronics Letters Accepted Version.pdf (278.62 kB)
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Ferrite-based room temperature negative temperature coefficient printed thermistors

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journal contribution
posted on 29.09.2020, 11:06 authored by Jack McGhee, Jagdeep Sagu, Darren SoutheeDarren Southee, Peter SA Evans, Upul Wijayantha-Kahagala-Gamage
Two screen printing inks were developed for the low-temperature fabrication of printed and flexible thick film negative temperature coefficient (NTC) thermistors able to operate at room temperature. The first of the two screen printing inks developed utilised cobalt ferrite (CoFe2O4) as the temperature sensing material with the second ink incorporating manganese ferrite (MnFe2O4). These were then screen printed onto lithographically printed silver interdigitated electrodes with a 200-micron track and gap using a synthetic paper (Teslin) as the substrate. The inks required a 10-minute curing step at 80oC. Preannealing of the ferrite powders before ink formulation enabled the avoidance of high-temperature processing post-fabrication typically required in industrial thermistor production. The printed thermistors were tested at a controlled constant humidity between 15 and 50oC. Both materials demonstrated typical natural logarithmic responses with high linearity and sensitivity.

History

School

  • Mechanical, Electrical and Manufacturing Engineering
  • Science
  • Design and Creative Arts

Department

  • Design
  • Chemistry

Published in

Electronics Letters

Volume

56

Issue

24

Pages

1322 - 1324

Publisher

Institution of Engineering and Technology (IET)

Version

AM (Accepted Manuscript)

Rights holder

© The Institution of Engineering and Technology

Publisher statement

This paper is a postprint of a paper submitted to and accepted for publication in Electronics Letters and is subject to Institution of Engineering and Technology Copyright. The copy of record is available at the IET Digital Library.

Acceptance date

28/09/2020

Publication date

2020-10-29

Copyright date

2020

ISSN

0013-5194

eISSN

1350-911X

Language

en

Depositor

Jack McGhee. Deposit date: 28 September 2020