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Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters

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journal contribution
posted on 28.01.2020 by Stuart Robertson, Scott Doak, Fu-Long Sun, Zhi-Quan Liu, Changqing Liu, Zhaoxia Zhou
A site‐specific xenon plasma focused ion beam preparation technique for microcantilever samples (1 μm ‐ 20 μm width and 1:10 aspect ratio) is presented. The novelty of the methodology is the use of a chunk lift‐out onto a clean silicon wafer to facilitate easy access of a low‐cost probe type indenter which provides bending force measurement. The lift‐out method allows sufficient room for the indenter and a line of sight for the electron beam to enable displacement measurement. An electroplated nanotwinned copper (NTC) was cut to a 3 × 3 × 25 μm micro‐beam and in‐situ mechanically tested using the developed technique. It demonstrated measured values of Youngs modulus of 78.7 ± 11 GPa and flow stress of 0.80 ± 0.05 GPa, which is within the ranges reported in the literature.

Funding

EPSRC EP/R032203/

EPSRC grant EP/P030599/1

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering
  • Mechanical, Electrical and Manufacturing Engineering

Department

  • Materials

Published in

Journal of Microscopy

Volume

279

Issue

3

Pages

212-216

Publisher

John Wiley & Sons Ltd on behalf of Royal Microscopical Society

Version

VoR (Version of Record)

Rights holder

© The Authors

Publisher statement

This is an Open Access Article. It is published by Wiley under the Creative Commons Attribution 4.0 International Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/

Acceptance date

23/01/2020

Publication date

2020-02-18

Copyright date

2020

ISSN

0022-2720

eISSN

1365-2818

Language

en

Depositor

Mr Stuart Robertson. Deposit date: 27 January 2020

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