Laser modified manuscript final version.pdf (1.67 MB)
Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters
journal contributionposted on 2021-03-24, 14:40 authored by Baofeng He, Jon PetzingJon Petzing, Patrick WebbPatrick Webb, Richard Leach
Glass is a promising substitute substrate material being evaluated for electronic packaging technology. Improving the electroless copper plated layer adhesion of the glass is one of the most important considerations for development of the technology. An excimer laser (248 nm) was used for structured texturing of glass surfaces (to improve adhesion) by changing mask dimensions, laser operating parameters and overlapping pitch spacing, and therefore producing a range of micro-scale features. Electroless plated copper adhesion strength was assessed using quantitative scratch testing, demonstrating that micro-patterned structures can significantly improve copper/glass adhesion. New ISO 25178 Part 2 areal surface texture parameters were used to characterise the surface roughness of ablated glass surfaces, and correlated to the scratch testing results. Highly correlated parameters were identified that could be used as predictive surface design tools, directly linking surface topography to adhesion performance, without the need for destructive adhesion quantification via scratch testing.
UK Engineering and Physical Sciences Research Council 3D-Mintegration Grand Challenge Project (EP/C534212/1)
Wolfson School of Mechanical & Manufacturing Engineering
2008 to 2011 UK National Measurement Office Engineering & Flow Metrology Programme
- Mechanical, Electrical and Manufacturing Engineering
Published inOptics and Lasers in Engineering
Pages39 - 47
- AM (Accepted Manuscript)
Rights holder© Elsevier
Publisher statementThis paper was accepted for publication in the journal Optics and Lasers in Engineering and the definitive published version is available at https://doi.org/10.1016/j.optlaseng.2015.06.004.