Self-propagating exothermic reaction (SPER) of alternating metal nanolayers provides intense localised heat that
allows bonding of metals or alloys under ambient temperature. However, the formation of the bonds through the
rapid heating and cooling confined at the bonding interfaces is a non-equilibrium process, and the thermal effect
on solidification and manufacturing reliability is yet to be understood. In this work, the Cu/Sn-nanofoil-Sn/Cu
interconnects (where Sn is a solder layer) prepared via SPER of Ni/Al nanofoil are studied by numerical simulations and experiments to understand the thermal transfer and its effect on the solidification. It has been found
that the SPER completes within a few milliseconds, the temperature at solder/Cu interface can be higher than the
melting point of solder, and the cooling rate can be as high as 1.5 × 107 ◦C/s, the maximum temperature gradient
can reach 5.40 × 107 ◦C/m. The microstructure predicted by simulation agrees well to the experimental results:
the columnar dendrites are formed in the solder during the cooling stage, and the columnar structures prefer to
form and grow in the solder region due to the high cooling rate.
Funding
(EPSRC) Heterogeneous integration to enable manufacture and assembly of power electronics : EP/R004501/1
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects : EP/R032203/1
History
School
Mechanical, Electrical and Manufacturing Engineering