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Lamination based embossing technique for LTCC
journal contributionposted on 09.07.2020, 14:02 by Stefan P Wilhelm, Robert W Kay, Mazher Mohammed, Yves Lacrotte, Marc PY Desmulliez
This article describes a LTCC embossing technique performed during the isostatic lamination process. The technique allows for the reduction of manufacturing steps by patterning simultaneously the top and bottom faces of a green ceramic tape using structured metal sheets. The experiments detail the manufacture of raised and recessed patterns on the self constrained HL2000 ceramic system, including bump arrays, raised wall structures and recessed channels.
Engineering and Physical Sciences Research Council (EPSRC) from the Innovative electronics Manufacturing Research Council (IeMRC) under the flagship project ‘‘Smart Microsystems’’.