Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations
journal contribution
posted on 2024-07-23, 11:07 authored by Li Liu, Chenru Zhang, Song Du, Zhiwen Chen, Simin LiSimin Li, Ziwen Chen, Qian Wang, Lingzhu Xie, Changqing LiuMechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations
Funding
Major Project of Hubei Province (Functional coating and materials, 2023BAA003)
Wuhan Knowledge Innovation Special Dawn Program (Grant No. 2023010201020320)
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Grant No. AWJ-23M09)
National Natural Science Foundation of China (Grant No. 62274122)
National Key R&D Program of China (Grant No. 2022YFB3207100)
Guangdong Basic and Applied Basic Research Foundation (Grant No. 2021A1515010651)
Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration (Wuhan University) (Grant No. EMPI2023010)
7th European Community Framework Programme Marie Curie International Research Staff Exchange Scheme (IRSES)
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
IntermetallicsVolume
172Publisher
ElsevierVersion
- AM (Accepted Manuscript)
Rights holder
© Elsevier LtdPublisher statement
This paper was accepted for publication in the journal Intermetallics published by Elsevier. The final publication is available at https://doi.org/10.1016/j.intermet.2024.108387. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/Acceptance date
2024-06-20Publication date
2024-06-25Copyright date
2024ISSN
0966-9795eISSN
0966-9795Publisher version
Language
- en
