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Mesomechanical modelling of SnAgCu solder joints in flip chip

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journal contribution
posted on 2008-10-17, 11:51 authored by Jicheng Gong, Changqing Liu, Paul ConwayPaul Conway, Vadim SilberschmidtVadim Silberschmidt
In modern microelectronic packages (considered here as a mesoscale), the size of microstructural features of an alloy is compatible with the scale of an entire element that can contain only one or a few grains. In this case, the mechanical behaviour of the element deviates from isotropic/homogenous character at the macroscopic scale of a bulk specimen, comprising a large number of randomly oriented grains. Generally, a crystal-plasticity model, which is based on dislocation sliding in certain slip systems, is applied to describe a local lattice-induced anisotropic behaviour. However, even at a room temperature, the movement of dislocations is not a single mechanism of the inelastic behaviour of eutectic SnAgCu solder due to its low melting point. Under a low-magnitude loading condition, creep also has an effect due to a movement of vacancies. At high temperatures, this creep can become a dominant mechanism for the inelastic behaviour, diminishing the role of the crystal-plasticity model. This paper accounts for the creep component of deformation and unites it with the traditional crystal-plasticity model. In addition, deformation due to thermal expansion is introduced into the constitutive equation to capture the major mechanisms of the mechanical behaviour of a SnAgCu solder micro-joint used in electronics.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

GONG, J. ... et al, 2008. Mesomechanical modelling of SnAgCu solder joints in flip chip. Computational Materials Science, 43 (1), pp. 199 -211 [doi:10.1016/j.commatsci.2007.07.039]

Publisher

© Elsevier

Publication date

2008

Notes

This is a journal article. It was published in the journal, Computational Materials Science [© Elsevier] and the definitive version is available at: http://www.sciencedirect.com/science/journal/09270256

ISSN

0927-0256

Language

  • en