Microstructure, flow behavior, and bulk texture evolution of cold drawn copper-silver composites
journal contributionposted on 13.10.2015, 13:56 by Srihari Dodla, P. Thiem, M. Kruger, D. Dietrich, A. Bertram
In the last 20 years, several groups used nanostructured composites to produce high strength conductor materials for magnetic applications. The mechanical strength of Cu-Ag composites is strongly influenced by metal forming operations. Within the scope of the paper, the microstructure, the mechanical behavior, and the texture evolution are investigated for two cold drawn Cu-63wt%Ag composite rods. The aim of these investigations is to understand the influence of the microstructure and texture evolution on the mechanical behavior. The investigation is carried out using optical microscopy, scanning electron microscopy (SEM) along with electron backscattered diffraction (EBSD), X-ray diffraction measurements (XRD), and compression testing. The microscopic images show that the drawn samples mainly have a lamellar structure of Cu and Ag phases. However, elliptical shaped regions of primarily solidified copper solid solution are also observed. With increase of plastic deformation, the average lamella thickness of both phases has been decreased. EBSD measurements show that abundant banded regions are observed in the Ag phase while very few banded regions are present in the Cu phase. The bulk XRD measurements reveal that both phases of the drawn samples initially have the same type of texture, and both phases develop the same brass-type (112) texture. The texture intensity increases for both phases as the drawing strain increases. Compression tests are performed at constant strain rate of 10-4 s-1 at room temperature. The stress-strain curves under compression are presented for two different drawn samples. The texture measurements after compression reveal that the texture becomes more pronounced.
Financial assistance from German Science Foundation (DFG) through GRK1554 is gratefully acknowledged.
- Mechanical, Electrical and Manufacturing Engineering