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Numerically established correlation in electrical responses of polymer film capacitors to ac and pulsed voltages

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posted on 2009-09-02, 13:37 authored by Yuen-Pen Lee, Michael G. Kong
In this paper, an equivalent circuit model is used to simulate electrical responses of metalized polymer film capacitors to either ac voltage or pulsed voltage stresses, in particular electric field induced on the electrode coating surface and power dissipation within the film capacitor. Electrode segmentation patterns are taken into consideration by means of arrays of interconnected lumped surface resistors, and the film capacitance is modeled by a set of shunt capacitors distributed across the length of the capacitor film. Voltage magnitude and waveform characteristics are studied in great detail for their effects on surface electric field and power dissipation. Through numerical examples, surface electric field and dissipated power induced by one type of external stress (ac or pulsed) at one frequency are shown to correlate with those at a different frequency. Further correlation is also established to relate surface field and dissipated power induced by one type stress (e.g. ac) to those by the other (pulsed), provided the waveform. characteristics of the two different stresses are specifically related. These numerically established correlations can permit significant reduction in development time of metalized film capacitors

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

LEE, Y.P. and KONG, M.G., 2001. Numerically established correlation in electrical responses of polymer film capacitors to ac and pulsed voltages. IEEE Transactions on Dielectrics and Electrical Insulation, 8(6), pp. 880-888.

Publisher

© IEEE

Version

  • VoR (Version of Record)

Publication date

2001

Notes

This article was published in the journal IEEE Transactions on Dielectrics and Electrical Insulation [© IEEE] and is also available at: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=94 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISSN

1070-9878

Language

  • en

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