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On the use of silver nanoparticles for direct micropatterning on polyimide substrates

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journal contribution
posted on 17.10.2013, 15:34 authored by Jack H.-G. Ng, David E.G. Watson, Joachim Sigwarth, Aongus McCarthy, Kevin A. Prior, Duncan P. Hand, Weixing Yu, Robert Kay, Changqing Liu, Marc P.Y. Desmulliez
This article proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photoand thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

NG, J.H.-G. ... et al, 2012. On the use of silver nanoparticles for direct micropatterning on polyimide substrates. IEEE Transactions on Nanotechnology, 11 (1), pp.139-147.

Publisher

© IEEE

Version

AM (Accepted Manuscript)

Publication date

2012

Notes

© 2012. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

ISSN

1536-125X

eISSN

1941-0085

Language

en