Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures.pdf (3.16 MB)
Plastic deformation of micromachined silicon diaphragms with a sealed cavity at high temperatures
journal contribution
posted on 2016-05-27, 10:22 authored by Juan Ren, Michael Ward, Peter KinnellPeter Kinnell, Russell Craddock, Xueyong WeiSingle crystal silicon (SCS) diaphragms are widely used as pressure sensitive elements
in micromachined pressure sensors. However, for harsh environments applications, pure silicon diaphragms are hardly used because of the deterioration of SCS in both electrical and mechanical properties. To survive at the elevated temperature, the silicon structures must work in combination
with other advanced materials, such as silicon carbide (SiC) or silicon on insulator (SOI), for improved performance and reduced cost. Hence, in order to extend the operating temperatures of existing SCS
microstructures, this work investigates the mechanical behavior of pressurized SCS diaphragms at high temperatures. A model was developed to predict the plastic deformation of SCS diaphragms and was verified by the experiments. The evolution of the deformation was obtained by studying the
surface profiles at different anneal stages. The slow continuous deformation was considered as creep for the diaphragms with a radius of 2.5 mm at 600 °C. The occurrence of plastic deformation was successfully predicted by the model and was observed at the operating temperature of 800 °C and
900 °C, respectively.
Funding
This work was supported the National Natural Science Foundation of China (Grant No. 51575439).
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
SENSORSVolume
16Issue
2Citation
REN, J. ...et al., 2016. Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures. Sensors, 16(2), 204.Publisher
MDPI AGVersion
- VoR (Version of Record)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution 4.0 International (CC BY 4.0) licence. Full details of this licence are available at: http://creativecommons.org/licenses/ by/4.0/Publication date
2016-02-05Notes
This is an Open Access Article. It is published by MDPI AG under the Creative Commons Attribution 4.0 Unported Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/ISSN
1424-8220Publisher version
Language
- en