posted on 2009-09-08, 15:43authored byGuangbin Dou, Y.C. Chan, J.E. Morris, David Whalley
The resistance, capacitance and inductance of Anisotropic Conductive Film (ACF) connections determine
their high frequency electrical characteristics. The presence of capacitance and inductance in the ACF joint
contributes to time delays and crosstalk noise as well as simultaneous switching noise (SSN) within the
circuit. The purpose of this paper is to establish an experimental method for estimating the capacitance and
inductance of a typical ACF connection. This can help to provide a more detailed understanding of the high
frequency performance of ACF assemblies.
Design/methodology/approach
Experiments on the transient response of an ACF joint were performed using a digital oscilloscope capable
of achieving the required ns resolution. An equivalent circuit model is proposed in order to quantify the
capacitance (C) and inductance (L) of a typical ACF connection and this model is fitted to the experimental
data. The equivalent model consisted of two resistors, an inductor, and a capacitor.
Findings
The capacitance and inductance of a typical ACF connection were estimated from the measured transient
response using Kirchhoff's Voltage Law. The method for estimation of R, L, and C from the transient
response is discussed, as are the RLC effects on the high frequency electrical characteristics of the ACF
connection.
Research limitations/implications
There was decay time deviation between the calculation and the experiment. It may be resulted from the
skin effect in the high frequency response and the adhesive surrounding joint as well. The main reason may
be the capacitance dielectric lost. Further research work will be done to test the dielectric lost in the ACA
joint.
What is original/value of paper
This paper presents a new method to characterise the high frequency properties of ACA interconnections
and will be of use to engineers evaluating the performance of ACF materials in high frequency applications.
History
School
Mechanical, Electrical and Manufacturing Engineering
Citation
DOU, G.....et al., 2006. RLC effects in fine pitch anisotropic conductive film connections. Soldering and Surface Mount Technology, 18(1), pp. 3-10