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Reliability assessment of a digital electronic board assembly using the physics-of-failure approach: a case study

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journal contribution
posted on 01.06.2009, 12:38 authored by Chucks N. Oguibe, David Williams
An independent study has been carried out to assess the extent to which the physics-of-failure (PoF) technique can help in reliability enhancement and assessment of electronic assemblies. In particular, a specific case study has been conducted on a real, digital electronic board assembly with known failure modes. Results from the study include the simulation of substrate and component temperatures based on the knowledge of component power dissipation, board assembly materials and cooling methods of the board assembly. The fundamental frequencies and dynamic displacements of the board were computed from the vibration models. The thermal and vibration results were then used to model the damage accumulation at solder joints of the components to accurately predict failure trends and failure sites. These results are compared with field failure data and results from other computer aided engineering (CAE) tools.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

OGUIBE, C.N. and WILLIAMS, D.J., 1999. Reliability assessment of a digital electronic board assembly using the physics-of-failure approach: a case study. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 213 (8), pp. 833-839

Publisher

Professional Engineering Publishing / © IMechE

Version

VoR (Version of Record)

Publication date

1999

Notes

This is an article from the journal, Proceedings of the IMechE, Part B: Journal of Engineering Manufacture [© IMechE]. It is also available at: http://journals.pepublishing.com/content/119784/?p=483cf2f3659441cdbcd851d8f3b10493&pi=0

ISSN

0954-4054

Language

en