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Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging

journal contribution
posted on 2015-11-16, 10:41 authored by Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An, Longzao Zhou
Sn99Cu1/Cu solder joints were investigated after isothermal aging at 175°C for different lengths of time under vacuum conditions. The results revealed height reduction of the solder of approximately 1.2 μm after aging for 1132.5 h. This was primarily attributed to growth of a layer of interfacial intermetallic compounds. The reduction was measured by use of a copper block containing a recess filled with solder, which was reflowed then polished flat. Height reduction of the solder joint during aging was found to obey the parabolic law \(\Delta h = -\!\!\hbox{ }0.031\sqrt t\), and was in excellent agreement with theoretical calculation.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

Journal of Electronic Materials

Citation

CHEN, Z. ...et al., 2015. Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging. Journal of Electronic Materials, 44(11), pp. 4058-4064.

Publisher

© The Minerals, Metals & Materials Society. Published by Springer.

Version

  • VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2015

Notes

This paper is in closed access.

ISSN

1543-186X

Language

  • en

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