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Temperature cycling of surface mounted thick film 'zero-ohm' jumpers

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journal contribution
posted on 21.10.2008, 11:01 by David Whalley, D.S. Campbell
Thermal cycling tests for surface mounted components are usually taken around a mean temperature of approximately 35°C (e.g., -55°C to +125°C; -40°C to +110°C). To test the effect of different maximum temperatures thermal cycling tests using a lower temperature of -55°C have been conducted with alumina/thick film 'zero-ohm' jumper chips with nickel barriers. These are connected in series chains and wave soldered on to FR-4 test coupons (128 chips/coupon). The test regimes used were -55°C to +5°C; +65°C; +95°C, +110°C and +125°C. Resistance changes before and after cycling were observed at room temperature. After 100 cycles changes of approximately +200 mΩ were observed against a total resistance of 5.5 Ω. However, more detailed examination showed that a top temperature of +95°C gives optimum results with a total change over 100 cycles of +4.9%.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

WHALLEY, D.C. and CAMPBELL, D.S., 1987. Temperature cycling of surface mounted thick film 'zero-ohm' jumpers. Hybrid Circuits, 4 (3), pp.68-70

Publisher

© Emerald

Publication date

1987

Notes

This journal article was published in the journal, Hybrid Cicuits (now known as Microelectronics International) [© Emerald] and the definitive version is available at: www.emeraldinsight.com/10.1108/eb044293

ISSN

1356-5362

Language

en

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Keywords

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