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The effect of ultrasonic additive manufacturing on integrated printed electronic conductors

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journal contribution
posted on 23.04.2018, 09:04 by Alkaios Bournias-Varotsis, Shanda Wang, David Hutt, Daniel Engstrom
Ultrasonic additive manufacturing (UAM) is a low temperature manufacturing method capable of embedding printed electronics in metal components. The effect of UAM processing on the resistivity of conductive tracks printed with five different conductive pastes based on silver, copper or carbon flakes/particles in either a thermoplastic or thermoset filler binder are investigated. For all but the carbon-based paste, the resistivity changed linearly with the UAM energy input. After UAM processing, a resistivity increase of more than 150 times was recorded for the copper based thermoset paste. The silver based pastes showed a resistivity increase of between 1.1 and 50 times from their initial values. The carbon-based paste showed no change in resistivity after UAM processing. Focussed Ion Beam (FIB) microstructure analysis of the printed conductive tracks before and after UAM processing showed that the silver particles and flakes in at least one of the pastes partly dislodged from their thermoset filler creating voids, thereby increasing the resistivity, whereas the silver flakes in a thermoplastic filler did not dislodge due to material flow of the polymer binder. The lowest resistivity (8·10-5 Ω-cm) after UAM processing was achieved for a thermoplastic paste with silver flakes at low UAM processing energy.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

Electronic Materials Letters

Citation

BOURNIAS-VAROTSIS, A. ...et al., 2018. The effect of ultrasonic additive manufacturing on integrated printed electronic conductors. Electronic Materials Letters, 14 (4), pp.413-425.

Publisher

Springer Verlag

Version

VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution 4.0 International (CC BY 4.0) licence. Full details of this licence are available at: http://creativecommons.org/licenses/ by/4.0/

Acceptance date

07/02/2018

Publication date

2018-03-13

Notes

This is an Open Access Article. It is published by Springer under the Creative Commons Attribution 4.0 Unported Licence (CC BY). Full details of this licence are available at: http://creativecommons.org/licenses/by/4.0/

ISSN

1738-8090

Language

en

Licence

Exports