The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers

Zhang, Yan; Liu, Changqing; Whalley, David

The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers

journal contribution

posted on 2013-03-18, 11:26 authored by Yan Zhang, Changqing Liu, David Whalley

The authors demonstrate the effect of substrate temperature on the relationship between the inkjet-etched via hole size and the number of drops of etchant dispensed. A mechanism for the different via hole size evolution versus the number of drops is proposed. An explanation for the interrelationship between the solvent evaporation rate and polymer re-deposition is presented. The aspect ratio of via holes produced is found to increase with the substrate temperature. Therefore, higher temperatures can be used to reduce the size and increase the aspect ratio of via holes fabricated by inkjet etching.

History

School

Mechanical, Electrical and Manufacturing Engineering

Citation

ZHANG, Y., LIU, C. and WHALLEY, D.C., 2013. The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers. Applied Physics Letters, 102 (10), 103303, doi: 10.1063/1.4795447

Publisher

Version

VoR (Version of Record)

Publication date

2013

Notes

This article was published in the journal, Applied Physics Letters [© American Institute of Physics] and may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The article may be found at: http://dx.doi.org/10.1063/1.4795447