The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers
journal contributionposted on 2013-03-18, 11:26 authored by Yan Zhang, Changqing LiuChangqing Liu, David Whalley
The authors demonstrate the effect of substrate temperature on the relationship between the inkjet-etched via hole size and the number of drops of etchant dispensed. A mechanism for the different via hole size evolution versus the number of drops is proposed. An explanation for the interrelationship between the solvent evaporation rate and polymer re-deposition is presented. The aspect ratio of via holes produced is found to increase with the substrate temperature. Therefore, higher temperatures can be used to reduce the size and increase the aspect ratio of via holes fabricated by inkjet etching.
- Mechanical, Electrical and Manufacturing Engineering
CitationZHANG, Y., LIU, C. and WHALLEY, D.C., 2013. The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers. Applied Physics Letters, 102 (10), 103303, doi: 10.1063/1.4795447
Publisher© American Institute of Physics
- VoR (Version of Record)
NotesThis article was published in the journal, Applied Physics Letters [© American Institute of Physics] and may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The article may be found at: http://dx.doi.org/10.1063/1.4795447