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Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics

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journal contribution
posted on 06.08.2019, 09:08 by Alkaios Bournias-Varotsis, Xiaoxiao Han, Russell A Harris, Daniel Engstrom
Embedded electronics and sensors are becoming increasingly important for the development of Industry 4.0. For small components, space constraints lead to full 3D integration requirements that are only achievable through Additive Manufacturing. Manufacturing metal components usually require high temperatures incompatible with electronics but Ultrasonic Additive Manufacturing (UAM) can produce components with mechanical properties close to bulk, but with the integration of internal embedded electronics, sensors or optics. This paper describes a novel manufacturing route for embedding electronics with 3D via connectors in an aluminium matrix. Metal foils with printed conductors and insulators were prepared separately from the UAM process thereby separating the electronics preparation from the part consolidation. A dual material polymer layer exhibited the best electrically insulating properties, while providing mechanical protection of printed conductive tracks stable up to 100°C. General design and UAM process recommendations are given for 3D embedded electronics in a metal matrix.

Funding

Engineering and Physical Sciences Research Council, UK via the Centre for Innovative Manufacturing in Additive Manufacturing

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

Additive Manufacturing

Volume

29

Publisher

Elsevier BV

Version

AM (Accepted Manuscript)

Rights holder

Elsevier

Publisher statement

This paper was accepted for publication in the journal Additive Manufacturing and the definitive published version is available at https://doi.org/10.1016/j.addma.2019.100799

Acceptance date

18/07/2019

Publication date

2019-07-19

Copyright date

2019

ISSN

2214-8604

Language

en

Article number

100799

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