posted on 2019-03-28, 15:09authored byScott M. Lewis, Antonio Fernandez-Mato, Guy A. DeRose, Matthew S. Hunt, George F. Whitehead, Agnese Lagzda, Hayden R. Alty, Jesus Ferrando-Soria, Sarah Varey, Andreas K. Kostopoulos, Fredrik Schedin, Christopher A. Muryn, Grigore A. Timco, Axel Scherer, Stephen G. Yeates, Richard E. Winpenny
A new resist material for electron beam lithography has been created that is based on a supramolecular assembly. Initial studies revealed that with this supramolecular approach, high‐resolution structures can be written that show unprecedented selectivity when exposed to etching conditions involving plasmas.
Funding
Engineering and Physical Sciences Research Council. Grant Number: EP/L018470/1 and Kavli Nanoscience Institute
History
School
Science
Department
Chemistry
Published in
Angewandte Chemie International Edition
Volume
56
Issue
24
Pages
6749 - 6752
Citation
LEWIS, S.M. ... et al, 2017. Use of supramolecular assemblies as lithographic resists. Angewandte Chemie International Edition, 56 (24), pp.6749-6752.
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/
Publication date
2017-05-15
Notes
This is the peer reviewed version of the following article: LEWIS, S.M. ... et al, 2017. Use of supramolecular assemblies as lithographic resists. Angewandte Chemie International Edition, 56 (24), pp.6749-6752, which has been published in final form at https://doi.org/10.1002/anie.201700224. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions.