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Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles

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posted on 13.11.2008 by Guangbin Dou, David Whalley, Changqing Liu
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over a decade and provide a high density and low temperature bonding method in a range of niche applications. In an ACA assembly, individual particles act as electrical conductors, providing current paths for fine pitch electronics interconnections. This paper presents a model of the electrical conduction characteristics of the solid metal particles used in some ACAs. Conduction through such ACA particles results from contact between the component and substrate pads and the particle, which is deformed by the assembly process. In order to investigate the effect of the extent of particle deformation, or transformation degree, upon the particle resistance, the particle transformation factor is defined. A mathematical model of the electrical resistance of an ACA particle, which is an integral function of the transformation factor and the particle geomehy, has been developed from a physical model of the ACA particle. MuthCAD software has been used to provide solutions for this function. According to these numerical solutions, the greater the particle transformation, the lower the particle resistance will be. In conclusion, it is shown that the ACA particle resistance is determined by the particle transformation and the particle geometries. Finally, the resistance function will explain the conductive mechanism of a deformed metal ACA particle.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

DOU, G., WHALLEY, D.C. and LIU, C., 2004. Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles. IN : 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, (POLYTRONIC 2004), 12-15 September, Portland USA, pp. 132-136.

Publisher

© IEEE

Publication date

2004

Notes

This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISBN

0780387449

Language

en

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