RC48.pdf (333.3 kB)

Solder paste reflow modeling for flip chip assembly

Download (333.3 kB)
online resource
posted on 07.11.2008, 16:54 by Samjid H. Mannan, D. Wheeler, David Hutt, David Whalley, Paul Conway, Chris Bailey
Solder paste printing and reflow can provide low cost techniques producing the solder bumps on flip chips. Solder paste consists of a dense suspension of solder particles in a fluid medium (vehicle) that acts as an oxide reducing agent (flux) during reflow, cleaning the metal surfaces of oxides. This paper reports on optical observations of paste behaviour at the small length scales associated with flip chip solder joints, and attempts to model the process using Computational Fluid Dynamics (CFD). Comparison of optical observations and CFD modelling show that the behaviour of the solder cannot be described simply by surface tension and viscous flow effects and it is deduced that oxides are still present on the solder surfaces during the early stages of reflow. The implications for paste heating method and solder volume are discussed, and a preliminary CFD model (based on FIDAP) incorporating the effect of the oxide layers is presented.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

MANNAN, S.H....et al., 2000. Solder paste reflow modeling for flip chip assembly. IN : 3rd Electronics Packaging Technology Conference, (EPTC 2000), 5-7 Dec, pp. 103-9.

Publisher

© IEEE

Publication date

2000

Notes

This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISBN

0780366441

Language

en

Exports

Logo branding

Keywords

Exports