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Degradation study of the peel strength of mini-modules under damp heat condition

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posted on 26.02.2014, 11:46 authored by Dan Wu, Jiang Zhu, Thomas R. Betts, Ralph Gottschalg
This paper presents the degradation study results of adhesion strength between backsheet and encapsulant for a commercial minimodule. A degradation model for the adhesion strength is developed and the activation energy is obtained. Outdoor prediction example is given based on environmental data in Loughborough and Denver

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Research Unit

  • Centre for Renewable Energy Systems Technology (CREST)

Citation

WU, D. ... et al., 2013. Degradation study of the peel strength of mini-modules under damp heat condition. Poster presented at the National Renewable Energy Laboratory (NREL) PV Module Reliability Workshop (PVMR), 2013.

Version

AM (Accepted Manuscript)

Publication date

2013

Notes

Poster presented at the NREL PVMR, 2013.

Language

en

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