Degradation study of the peel strength of mini-modules under damp heat condition
posterposted on 2014-02-26, 11:46 authored by Dan Wu, Jiang Zhu, Thomas R. Betts, Ralph Gottschalg
This paper presents the degradation study results of adhesion strength between backsheet and encapsulant for a commercial minimodule. A degradation model for the adhesion strength is developed and the activation energy is obtained. Outdoor prediction example is given based on environmental data in Loughborough and Denver
- Mechanical, Electrical and Manufacturing Engineering
- Centre for Renewable Energy Systems Technology (CREST)
CitationWU, D. ... et al., 2013. Degradation study of the peel strength of mini-modules under damp heat condition. Poster presented at the National Renewable Energy Laboratory (NREL) PV Module Reliability Workshop (PVMR), 2013.
- AM (Accepted Manuscript)
NotesPoster presented at the NREL PVMR, 2013.