pvmrw13_ps4_crest_wu.pdf (1.51 MB)
Download fileDegradation study of the peel strength of mini-modules under damp heat condition
poster
posted on 2014-02-26, 11:46 authored by Dan Wu, Jiang Zhu, Thomas R. Betts, Ralph GottschalgThis paper presents the degradation study results of adhesion strength between backsheet and encapsulant for a commercial minimodule. A degradation model for the adhesion strength is developed and the activation energy is obtained.
Outdoor prediction example is given based on environmental data in Loughborough and Denver
History
School
- Mechanical, Electrical and Manufacturing Engineering
Research Unit
- Centre for Renewable Energy Systems Technology (CREST)