A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
thesisposted on 2017-11-02, 09:55 authored by Mahadevan K. Iyer
Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need for faster interconnects for gigabit logic MCMs has been discussed in this thesis. Techniques to avoid the problem of taking high speed interconnections through multilayer substrates include radiative and optical techniques. The present research work concentrates on a radiative interconnection technique. [Continues.]
Loughborough University (John Guest Philips Travelling Scholarship). Commonwealth Commission. British Council. India, Ministry of Human Resources and Development.
- Mechanical, Electrical and Manufacturing Engineering
Publisher© Mahadevan Krishna Iyer
Publisher statementThis work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 2.5 Generic (CC BY-NC-ND 2.5) licence. Full details of this licence are available at: http://creativecommons.org/licenses/by-nc-nd/2.5/
NotesA Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.