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Effects of packaging elements on the thermal hysteresis of piezoresistive pressure sensors

thesis
posted on 2021-11-22, 16:58 authored by Youssef Hamid
Effects of packaging elements on the thermal hysteresis of piezoresistive pressure sensors

Funding

EP/L014998/1

EPSRC Centre for Doctoral Training in Embedded Intelligence

Engineering and Physical Sciences Research Council

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History

School

  • Mechanical, Electrical and Manufacturing Engineering

Publisher

Loughborough University

Rights holder

© Youssef Hamid

Publication date

2021

Notes

A thesis submitted in partial fulfilment of the requirements for the award of the degree of Doctor of Philosophy of Loughborough University.

Language

  • en

Supervisor(s)

David Hutt ; David Whalley

Qualification name

  • PhD

Qualification level

  • Doctoral

This submission includes a signed certificate in addition to the thesis file(s)

  • I have submitted a signed certificate

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    Mechanical, Electrical and Manufacturing Engineering Theses

    Categories

    Keywords

    piezoresistive pressure sensorthermal hysteresispackaging levelsconsecutive packagingpolynomial fittingfinite element analysiscreepMechanical Engineering not elsewhere classified

    Licence

    CC BY-NC-ND 4.0

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