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Electrical conduction stability of copper-filled adhesives in high-moisture environments
thesis
posted on 2020-11-06, 15:18 authored by Shanda WangElectrical conduction stability of copper-filled adhesives in high-moisture environments
History
School
- Mechanical, Electrical and Manufacturing Engineering
Publisher
Loughborough UniversityRights holder
© S. WangPublication date
2020Notes
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of the degree of Doctor of Philosophy of Loughborough University.Language
- en
Supervisor(s)
David Hutt ; David Whalley ; Gary CritchlowQualification name
- PhD
Qualification level
- Doctoral
This submission includes a signed certificate in addition to the thesis file(s)
- I have submitted a signed certificate
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Keywords
Self-Assembled MonolayerIsotropic Conductive AdhesivesConduction MechanismFailure MechanismElectrical InterconnectionReliability TestStability TestHigh MoistureCopperEpoxyX-ray Photoelectron SpectroscopyScanning Electron MicroscopyTransmission Electron MicroscopyMechanical Engineering not elsewhere classified
