File(s) under embargo
Reason: This thesis is confidential. For more information please email etheses@lboro.ac.uk.
2
month(s)28
day(s)until file(s) become available
Electrical conduction stability of copper-filled adhesives in high-moisture environments
thesis
posted on 2020-11-06, 15:18 authored by Shanda WangElectrical conduction stability of copper-filled adhesives in high-moisture environments
History
School
- Mechanical, Electrical and Manufacturing Engineering
Publisher
Loughborough UniversityRights holder
© S. WangPublication date
2020Notes
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of the degree of Doctor of Philosophy of Loughborough University.Language
enSupervisor(s)
David Hutt ; David Whalley ; Gary CritchlowQualification name
PhDQualification level
DoctoralThis submission includes a signed certificate in addition to the thesis file(s)
I have submitted a signed certificateAdministrator link
Usage metrics
Keywords
Self-Assembled MonolayerIsotropic Conductive AdhesivesConduction MechanismFailure MechanismElectrical InterconnectionReliability TestStability TestHigh MoistureCopperEpoxyX-ray Photoelectron SpectroscopyScanning Electron MicroscopyTransmission Electron MicroscopyMechanical Engineering not elsewhere classified
CC BY-NC-ND 4.0