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Electrical conduction stability of copper-filled adhesives in high-moisture environments

thesis
posted on 06.11.2020, 15:18 by Shanda Wang
Electrical conduction stability of copper-filled adhesives in high-moisture environments

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Publisher

Loughborough University

Rights holder

© S. Wang

Publication date

2020

Notes

A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of the degree of Doctor of Philosophy of Loughborough University.

Language

en

Supervisor(s)

David Hutt ; David Whalley ; Gary Critchlow

Qualification name

PhD

Qualification level

Doctoral

This submission includes a signed certificate in addition to the thesis file(s)

I have submitted a signed certificate

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