posted on 2012-11-27, 10:16authored byYean Thye Ng
The growing demand in portable and compact consumer devices and
appliances has resulted in the need for the miniaturisation of electronic
components. These miniaturised electronic components are sensitive and
susceptible to damage by voltages as low as 20V. Electrically conductive
styrenic thermoplastics are widely used in electronic packaging applications to
protect these sensitive electronic components against electro-static discharge
(ESD) during manufacturing, assembly, storage and shipping. Such ESD
applications often require the optimal volume resistance range of ≥ 1.0x105 to
< 1.0x108 Ω. The best known method to render styrenic thermoplastics
conductive is by the incorporation of conductive fillers, such as carbon black
but the main limitation is the difficulty in controlling the conductivity level due
to the steep percolation curve. Thus the aim of this research is to develop
electrically conductive styrenic thermoplastics by blending several styrenic
resins with polymeric conductive additives to achieve optimal volume
resistance range for ESD applications with the ease in controlling the
conductivity level. [Continues.]
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Aeronautical, Automotive, Chemical and Materials Engineering