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Embedding electronic circuitry into a metal matrix via ultrasonic additive manufacturing: material considerations and process development

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thesis
posted on 19.11.2018, 11:17 by Alkaios Bournias-Varotsis
Ultrasonic Additive Manufacturing (UAM) is a hybrid metal additive manufacturing process, based on the layer-by-layer ultrasonic welding of thin metal foils and the periodic CNC machining of the bonded layers to achieve the desired three-dimensional geometry. Bonding in UAM occurs in the solid state and at low temperature, making UAM a potential technology for embedding electronic circuitry into metal structures.Printed Electronics (PE) is a family of processes that can fabricate electronic circuitry and components by directly dispensing functional materials onto a substrate. PE technologies have a high potential for integration with additive manufacturing processes, as they both follow similar basic manufacturing principles. Such integration can enable the fabrication of multi-functional parts with embedded electronic circuitry. [Continues.]

Funding

EPSRC

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Publisher

Loughborough University

Rights holder

© Alkaios Bournias-Varotsis

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2018

Notes

A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy of Loughborough University.

Language

en

Supervisor(s)

Daniel Engstrom

Qualification name

PhD

Qualification level

Doctoral