Embedding electronic circuitry into a metal matrix via ultrasonic additive manufacturing: material considerations and process development

Ultrasonic Additive Manufacturing (UAM) is a hybrid metal additive manufacturing process, based on the layer-by-layer ultrasonic welding of thin metal foils and the periodic CNC machining of the bonded layers to achieve the desired three-dimensional geometry. Bonding in UAM occurs in the solid state and at low temperature, making UAM a potential technology for embedding electronic circuitry into metal structures.Printed Electronics (PE) is a family of processes that can fabricate electronic circuitry and components by directly dispensing functional materials onto a substrate. PE technologies have a high potential for integration with additive manufacturing processes, as they both follow similar basic manufacturing principles. Such integration can enable the fabrication of multi-functional parts with embedded electronic circuitry. [Continues.]