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Excimer laser machining of glass for high density substrate manufacture

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thesis
posted on 16.01.2018, 09:32 by Deepa M. Bhatt
The widely growing market of miniaturized electronic devices demands for alternative substrate materials and manufacturing technologies on which fine pitch components can be mounted. Glass has been identified as a potential substrate material as it offers a number of advantages including a coefficient of thermal expansion closely matched to that of silicon that may reduce the thermo-mechanical stresses on the interconnects in the flip-chip assemblies. In addition to this, its dimensional stability and optically transparent nature facilitates alignment of multiple layer structures, enabling accurate drilling of microvias to capture pads and the potential for applications in optical interconnect. [Continues.]

Funding

EPSRC.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Publisher

© Deepa Bhatt

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 2.5 Generic (CC BY-NC-ND 2.5) licence. Full details of this licence are available at: http://creativecommons.org/licenses/by-nc-nd/2.5/

Publication date

2009

Notes

A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.

Language

en

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