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Gallium-based transient liquid phase bonding for Cu-Cu electronic interconnections
Gallium-based transient liquid phase bonding for Cu-Cu electronic interconnections
Funding
Loughborough University
History
School
- Mechanical, Electrical and Manufacturing Engineering
Publisher
Loughborough UniversityRights holder
© Yi ChenPublication date
2023Notes
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of the degree of Doctor of Philosophy of Loughborough University.Language
- en
Supervisor(s)
Changqing Liu ; Zhaoxia ZhouQualification name
- PhD
Qualification level
- Doctoral
Loughborough Email address
y.chen5@lboro.ac.ukThis submission includes a signed certificate in addition to the thesis file(s)
- I have submitted a signed certificate