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Novel manufacture of out-of-plane optical interconnects to enable low-cost OECB substrates

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thesis
posted on 15.10.2018, 15:37 by Paul Misselbrook
Due to their bandwidth capacity, optical interconnects are beginning to replace bandwidth limited copper as bottlenecks appear on both inter-board, VSR interconnects and also inter-board, USR interconnects. Consequently, low-cost, optically enabled circuit boards are a key milestone on electronic roadmaps. Benefits exist in developing guided wave technologies, which have been classified into three generations. First- and second-generation technologies are based upon optical fibres and are both capable of providing a suitable platform for inter-board applications. However, to allow component assembly, an integral requirement for intra-board applications, low-cost third-generation OECBs containing embedded polymer waveguides are desirable. [Continues.]

Funding

Engineering and Physical Sciences Research Council (EPSRC) and Celestica Inc. (Industrial CASE Award).

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Publisher

© Paul Misselbrook

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2005

Notes

A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.

Language

en

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