On the integration of deformation and relief measurement using ESPI

The combination of relief and deformation measurement is investigated for improving the accuracy of Electronic Speckle-Pattern Interferometry (ESPI) data. The nature of sensitivity variations within different types of interferometers and with different shapes of objects is analysed, revealing significant variations for some common interferometers. Novel techniques are developed for real-time measurement of dynamic events by means of carrier fringes. This allows quantification of deformation and relief, where the latter is used in the correction of the sensitivity variations of the former.