On the integration of deformation and relief measurement using ESPI
thesisposted on 01.08.2018 by David I. Farrant
In order to distinguish essays and pre-prints from academic theses, we have a separate category. These are often much longer text based documents than a paper.
The combination of relief and deformation measurement is investigated for improving the accuracy of Electronic Speckle-Pattern Interferometry (ESPI) data. The nature of sensitivity variations within different types of interferometers and with different shapes of objects is analysed, revealing significant variations for some common interferometers. Novel techniques are developed for real-time measurement of dynamic events by means of carrier fringes. This allows quantification of deformation and relief, where the latter is used in the correction of the sensitivity variations of the former.
- Mechanical, Electrical and Manufacturing Engineering