Performance of wire-bonded interconnects under combined thermal and vibration loads

Wire bonding is the process of providing electrical interconnections between an integrated circuit and the rest of the electronic package. Although wire bonding has been extensively utilised for chip-level interconnections, there is a lack of fundamental knowledge related to the reliability performance of wire bonded electronic devices in harsh environment applications such in aerospace and oil & gas industries. This thesis addresses the fundamental reliability aspects of Au- and Pd-coated Cu wire interconnects bonded on Au- and Al-metallized bond pads respectively.The research described in this thesis investigates the performance of wire bonded electronic devices under complex harsh conditions. [Continues.]