Thesis-2015-Mirgkizoud2.pdf (8.11 MB)
Performance of wire-bonded interconnects under combined thermal and vibration loads
thesis
posted on 2015-06-24, 08:09 authored by Maria MirgkizoudiWire bonding is the process of providing electrical interconnections between an integrated circuit and the rest of the electronic package. Although wire bonding has been extensively utilised for chip-level interconnections, there is a lack of fundamental knowledge related to the reliability performance of wire bonded electronic devices in harsh environment applications such in aerospace and oil & gas industries. This thesis addresses the fundamental reliability aspects of Au- and Pd-coated Cu wire interconnects bonded on Au- and Al-metallized bond pads respectively.The research described in this thesis investigates the performance of wire bonded electronic devices under complex harsh conditions. [Continues.]
Funding
IeMRC
History
School
- Mechanical, Electrical and Manufacturing Engineering
Publisher
Loughborough UniversityRights holder
© Maria MirgkizoudiPublisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Publication date
2015Notes
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy of Loughborough University.Language
- en
Supervisor(s)
Paul Conway ; Changqing LiuQualification name
- PhD
Qualification level
- Doctoral