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Properties and behaviour of Pb-free solders in flip-chip scale solder interconnections

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thesis
posted on 31.07.2018, 10:00 by Dezhi Li
Due to pending legislations and market pressure, lead-free solders will replace Sn–Pb solders in 2006. Among the lead-free solders being studied, eutectic Sn–Ag, Sn–Cu and Sn–Ag–Cu are promising candidates and Sn–3.8Ag–0.7Cu could be the most appropriate replacement due to its overall balance of properties. In order to garner more understanding of lead-free solders and their application in flip-chip scale packages, the properties of lead free solders, including the wettability, intermetallic compound (IMC) growth and distribution, mechanical properties, reliability and corrosion resistance, were studied and are presented in this thesis. [Continues.]

Funding

Loughborough University, Wolfson School of Mechanical and Manufacturing Engineering; Innovative Manufacturing and Construction Research Centre.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Publisher

© Dezhi Li

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Publication date

2005

Notes

A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.

Language

en

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Keywords

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