Thesis-2005-Li.pdf (14.45 MB)
Properties and behaviour of Pb-free solders in flip-chip scale solder interconnections
thesisposted on 2018-07-31, 10:00 authored by Dezhi Li
Due to pending legislations and market pressure, lead-free solders will replace Sn–Pb solders in 2006. Among the lead-free solders being studied, eutectic Sn–Ag, Sn–Cu and Sn–Ag–Cu are promising candidates and Sn–3.8Ag–0.7Cu could be the most appropriate replacement due to its overall balance of properties. In order to garner more understanding of lead-free solders and their application in flip-chip scale packages, the properties of lead free solders, including the wettability, intermetallic compound (IMC) growth and distribution, mechanical properties, reliability and corrosion resistance, were studied and are presented in this thesis. [Continues.]
Loughborough University, Wolfson School of Mechanical and Manufacturing Engineering; Innovative Manufacturing and Construction Research Centre.
- Mechanical, Electrical and Manufacturing Engineering
Publisher© Dezhi Li
Publisher statementThis work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/
NotesA Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.