Thesis-2005-Li.pdf (14.45 MB)
Download fileProperties and behaviour of Pb-free solders in flip-chip scale solder interconnections
thesis
posted on 2018-07-31, 10:00 authored by Dezhi LiDue to pending legislations and market pressure, lead-free solders will replace Sn–Pb
solders in 2006. Among the lead-free solders being studied, eutectic Sn–Ag, Sn–Cu and
Sn–Ag–Cu are promising candidates and Sn–3.8Ag–0.7Cu could be the most appropriate
replacement due to its overall balance of properties. In order to garner more
understanding of lead-free solders and their application in flip-chip scale packages, the
properties of lead free solders, including the wettability, intermetallic compound (IMC)
growth and distribution, mechanical properties, reliability and corrosion resistance, were
studied and are presented in this thesis. [Continues.]
Funding
Loughborough University, Wolfson School of Mechanical and Manufacturing Engineering; Innovative Manufacturing and Construction Research Centre.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Publisher
© Dezhi LiPublisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Publication date
2005Notes
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.Language
- en