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Spring contact probes: wear characteristics testing for electrical and mechanical parameters

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posted on 09.05.2018, 10:10 by Michael Elston
The study considers the development and evaluation of spring contact probes used for automated testing of printed circuit boards (PCBs) and assemblies. It considers the evolution of circuit technology which originated from the introduction of the thermionic valve at the beginning of the century. Since the introduction of the integrated circuit in the 1960's, the industry has seen considerable advances in integrated and printed circuit miniaturisation with its associated effect on the testability of the completed assembly. The close spacing between the tracks and pads within the printed circuit board, which is possibly loaded on both sides with integrated circuits and other components with fine pitch termination spacings, has initiated the rapid development of a specialised electronic test industry to ensure product quality. [Continues.]



  • Mechanical, Electrical and Manufacturing Engineering


© Michael Elston

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This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at:

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A Master's Thesis. Submitted in partial fulfilment of the requirements for the award of Master of Philosophy at Loughborough University.



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Mechanical, Electrical and Manufacturing Engineering Theses