As the speed of logic integrated circuits
increases, the effects of the package and the interconnections
become more significant. Hybrid technology
can be used to eliminate the need for individual packaging
of the integrated circuits but now the interconnections are
generally closer together and must be considered as a
coupled system. Therefore it is very important to have a
general method of analysing multiconductor transmission line
structures as found in high speed logic systems. [Continues.]
Funding
Science Research Council. British Telecom PLC, Research Dept.
History
School
Mechanical, Electrical and Manufacturing Engineering
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Publication date
1980
Notes
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.